Processing capabilities

Here are the processing capabilities for PRINTOR’s PCBs and assembly services. Should your project require unique solutions, contact PRINTOR to find the best solution to suit your needs.


PCB

Max PCB size [mm]: 450 – 600
Laminate thickness [mm]: 0,2 – 3,2
Copper layer thickness
Material [um]: 12

18

35

70

105

Finished plating thickness [um]: 30

35

60

95

130

Substrate materials: FR4, CEM, Aluminium, flex
Copper plating: HAL RoHS, HAL Pb, OSP, chemical gold plating or electroplating; silver plating
Options: carbon pastel; peelable masks
UL marking
Available solder resits colours: green (standard)
red
black
white
blue
other, as ordered
Value [mm]: recommended [mm]:
Min. hole dia.: 0,1 0,3
Min. copper to copper spacing: 0,1 0,2
Min. path width: 0,1 0,2
No. of layers: 18
Blind and buried vias: tak

Assembly

Min. component size: 01005; uBGA
Max. panel size: 400 x 510
Technology: RoHS or Pb process
Bonded assembly
ICT and FCT
Solder wave / Selective solder wave; RoHS / Pb

Quotations

Need a quote for your project? Complete our on-line RFQ form to submit the essential data for PRINTOR to create a quote for you.

Quotations

Glossary

This glossary provides the definitions of most common terminology in the electronic assembly sector.

Glossary

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We would like to inform that we are closed for holidays from 05.08.2019 untill 16.08.2019.
We are back to work at 19.08.2019.

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