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Technological possibilities

Our machine park is a series of specialized machines that meet high standards of quality and production safety. We know how important it is to follow the development of technology, which is why we invest in the purchase of new equipment, constantly develop our plant so that our Customers always receive high quality products.

We support your business – we are not afraid of challenges

Does your project require a specific solution or customized steps? Contact us. We have taken under many difficult challenges and we have proven more than once that we can implement a project that everyone else was afraid to undertake.

PCB

Max. PCB size [mm]:
450-600
Laminate thickness: [mm]:
0,2 – 3,2
Copper thickness
Material [um]:
12
18
35
70
105
Final thickness after metallization [um]:
30
35
60
95
130
Materials:
FR4, CEM, Aluminum, flex/flexible
Copper plating:
HAL RoHS, HAL Pb, OSP, chemical or galvanic gold plating, silver plating
Additionally:
carbon paste, UL peelable mask, marking
Available soldermask colors:
green (standard)
red
black
white
blue
other colors on customer’s request
The minimum hole diameter
Value [mm]:
0,1
Recommended [mm]:
0,3
The minimum distance copper – copper
Value [mm]:
0,1
Recommended [mm]:
0,2
Minimum path width
Value [mm]:
0,1
Recommended [mm]:
0,2
The number of layers:
18
Blind and buried guides:

Assembly

The smallest component:
01005; uBGA
Max. panel size:
400 x 510
Technology:
RoHS or leaded (Pb)
Adhesive mounting
ICT, FCT
Selective wave / wave, Rohs / Pb

Machine park

Main SMT assembly line:

  • Solder paste printer: ASM – DEK NeoHorizon 03 iX
  • Solder paste control (SPI): ASM – ProcessExpert
  • Pick&Place: ASM – SIPLACE SX1 (CP20P) + ASM – SIPLACE SX1 (CPP)
  • Soldering furnace: Vitronics Soltec – CENTURION 1040A
  • Optical control (AOI): OMRON – VT-S530, 3D (Moore effect)

Second SMT assembly line:

  • Solder paste printer: DEK Infinity
  • Pick&Place: ASSEMBLEON OPAL XII, ASSEMBLEON MG-1R
  • Soldering furnace: Vitronics Soltec – REHM VXs basic 3150
  • Optical control (AOI): NORDSON YESTECH BX + NORDSON YESTECH B3

THT department:

  • 3 semi-automatic THT assembly stations
  • Wire / wire processing equipment
  • Wave soldering: SEHO GoWave 1030, HWL 240/2 HEEB INOTEC
  • Selective wave soldering: Interselect IS-B-510 double, Inertec  ELS 3.0

PCB Department, Quality Department:

  • Machining Units: Micronic, HML, Filotec, Resco, Excellon
  • Chemical and galvanic metallization using Shipley technology
  • “Flying probe” test: A5 Neo ATG Luther&Maelzer, PROBOT 880-05 Mania Technologie
  • “Bed of nails” test: ELECTRONIA AB DV 12 TB, ELECTRONIA AB DV 12 S
  • ICT: Prueftechnik S&K Ti2ger
  • Measurement of ionic purity: lonograph 500 M, Alpha Metals

Glossary of terms – worth knowing

Learn about the most commonly used phrases in the electronics industry

-> Go to the Terms Dictionary page

Are you looking for an EMS Partner? We invite you to contact us directly.

We are happy to talk about your needs. Our experts are at your disposal.

Linkedin
Anna Kucharczyk

Sales Manager
+48 664 489 324
anna.kucharczyk@printor.pl

Linkedin
Agnieszka Jobda

Sales specialist
+48 42 652 79 44
agnieszka.jobda@printor.pl

Files to download – necessary in the process of submitting requests


BOM EN sheet a list of all elements used in assembly




BOM sheet – polish version




See the general conditions of sale



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