Technology - Printor

Technological possibilities

Our machine park is a series of specialized machines that meet high standards of quality and production safety. We know how important it is to follow the development of technology, which is why we invest in the purchase of new equipment, constantly develop our plant so that our Customers always receive high quality products.

We support your business – we are not afraid of challenges

Does your project require a specific solution or customized steps? Contact us. We have taken under many difficult challenges and we have proven more than once that we can implement a project that everyone else was afraid to undertake.

PCB

Max. PCB size [mm]:

450-600

Laminate thickness: [mm]:

0,2 – 3,2

Copper thickness

Material [um]:

12
18
35
70
105

Final thickness after metallization [um]:

30
35
60
95
130

Materials:

FR4, CEM, Aluminum, flex/flexible

Copper plating:

HAL RoHS, HAL Pb, OSP, chemical or galvanic gold plating, silver plating

Additionally:

carbon paste, UL peelable mask, marking

Available soldermask colors:

green (standard)
red
black
white
blue
other colors on customer’s request

The minimum hole diameter

Value [mm]:

0,1

Recommended [mm]:

0,3

The minimum distance copper – copper

Value [mm]:

0,1

Recommended [mm]:

0,2

Minimum path width

Value [mm]:

0,1

Recommended [mm]:

0,2

The number of layers:

Blind and buried guides:

Assembly

The smallest component:

01005; uBGA

Max. panel size:

400 x 510

Technology:

RoHS or leaded (Pb)

Adhesive mounting

ICT, FCT

Selective wave / wave, Rohs / Pb

Machine park

Main SMT assembly line:

Solder paste printer: ASM – DEK NeoHorizon 03 iX
Solder paste control (SPI): ASM – ProcessExpert
Pick&Place: ASM – SIPLACE SX1 (CP20P) + ASM – SIPLACE SX1 (CPP)
Soldering furnace: Vitronics Soltec – CENTURION 1040A
Optical control (AOI): OMRON – VT-S530, 3D (Moore effect)

Second SMT assembly line:

Solder paste printer: DEK Infinity
Pick&Place: ASSEMBLEON OPAL XII, ASSEMBLEON MG-1R
Soldering furnace: Vitronics Soltec – REHM VXs basic 3150
Optical control (AOI): NORDSON YESTECH BX + NORDSON YESTECH B3

THT department:

3 semi-automatic THT assembly stations
Wire / wire processing equipment
Wave soldering: SEHO GoWave 1030, HWL 240/2 HEEB INOTEC
Selective wave soldering: Interselect IS-B-510 double, Inertec ELS 3.0

PCB Department, Quality Department:

Machining Units: Micronic, HML, Filotec, Resco, Excellon
Chemical and galvanic metallization using Shipley technology
“Flying probe” test: A5 Neo ATG Luther&Maelzer, PROBOT 880-05 Mania Technologie
“Bed of nails” test: ELECTRONIA AB DV 12 TB, ELECTRONIA AB DV 12 S
ICT: Prueftechnik S&K Ti2ger
Measurement of ionic purity: lonograph 500 M, Alpha Metals